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Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
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Statement regarding speculative media coverage
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PFN, Rapidus and SAKURA internet Reach Basic Agreement toward Japan-Made AI Infrastructure for Greener Society Companies to build cloud infrastructure equipped with low-power AI semiconductors using latest manufacturing process
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Rapidus begins installation of Japan’s first NXE:3800E EUV lithography machinery for semiconductor mass production
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Rapidus Collaborates with Cadence on Leading-Edge 2nm Semiconductor Solutions for AI and HPC ApplicationsCollaboration spans interface and memory IP utilizing 2nm gate-all-around, BSPDN technology and AI-driven reference flows to facilitate the development of advanced, energy-efficient chips
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Rapidus Collaborates with Synopsys to Shorten Semiconductor Design Cycles
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IBM Research and Rapidus co-authored paper accepted at IEDM 2024
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Statement Regarding Rapidus Funding Rumors
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Rapidus establishes state-of-the-art back-end semiconductor manufacturing process research-and-development centerRapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson’s Chitose campus
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Rapidus Recognized on EE Times’ “Silicon 100” for Second Consecutive Year
Advanced R&D and Manufacturing Base, “IIM”
Rapidus is building its IIM in Chitose, Hokkaido as an R&D and Manufacturing base for next-generation logic semiconductors.
Rapidus Solutions
Next Generation Foundry Model: “RUMS”
What is the "World’s Fastest Manufacturing Cycle Time"?
Core Solutions: ”DMCO” and ”Raads”
What is the technology of using AI to maximize the efficiency of design and developing semiconductors?
Key Technology: ”GAA”
What is "GAA", the key technology of 2nm semiconductors that enables high performance and low power consumption?
Message from the CEO
Rapidus Corporation is committed to designing and manufacturing the world's most advanced logic semiconductors.
We will work with our customers to create new industries by developing and delivering services that reduce cycle times for design, wafer processing and 3D packaging
Dr. Atsuyoshi KoikeCEO
Rapidus Corporation