NEWS

Rapidus Signs Comprehensive Collaboration Agreement with Hokkaido UniversityGoal is to enhance Japan’s scientific and technological capabilities, and develop human resources for the semiconductor industry

June 5, 2024 – Rapidus Corporation (Head Office: 4-1 Kojimachi, Chiyoda-ku, Tokyo; President and CEO: Atsuyoshi Koike) today announced that it has signed a comprehensive collaboration agreement for education and research with Hokkaido University (Kita 8, Nishi 5, Kita-ku, Sapporo, Hokkaido; President: Kiyohiro Houkin). The purpose of this agreement is to contribute to the enhancement of Japan’s scientific and technological capabilities and develop human resources for the semiconductor industry.

Hokkaido is rapidly supporting the growth of Japan’s semiconductor industry, facilitating human resource development and research and development (R&D). With Rapidus’ pilot line to begin operation in April 2025 with mass production in 2027, the two parties have committed to a comprehensive collaboration agreement for the purpose of promoting long-term cooperation in the development of high-level human resources and advanced semiconductor research.

The details of collaboration and cooperation are:

(1) Training and education of semiconductor-related human resources
(2) Research cooperation in advanced semiconductor research, etc.
(3) Use of facilities and equipment
(4) Other matters as agreed upon and deemed necessary to achieve the objectives of this agreement

A base will be established on the campus of Hokkaido University by the end of 2024 where Rapidus will evaluate and analyze 2nm semiconductors. The companies will promote R&D projects for advanced semiconductors and Rapidus will also participate in advanced semiconductor research that takes advantage of the unique research features from Hokkaido University.

Regarding semiconductor-related human resource development, Rapidus plans to dispatch its engineers to Hokkaido University to give lectures while Hokkaido University plans to provide Rapidus engineers with opportunities to learn about its latest research results.

At the signing ceremony for the Comprehensive Collaborative Agreement held on June 5, 2024, at Hokkaido University. From left to right: Kiyohiro Houkin, President, Hokkaido University, and Atsuyoshi Koike, President and CEO, Rapidus Corporation.


About Hokkaido University

Hokkaido University has developed as the only university in the vast land of Hokkaido with four basic philosophies of education and research: “Frontier Spirit,” “Global Perspectives,” “All-round Education,” and “Practical Learning.” We will establish the “Novel Japan University Model,” a new Japanese university model that creates a large social impact from solving global problems and move forward strongly toward realizing the world’s common goal of a “sustainable well-being society.”

National University Corporation, Hokkaido University
Location: Kita 8, Nishi 5, Kita-ku, Sapporo, Hokkaido
Founded: August 14, 1876 (as Sapporo Agricultural College)
President: Kiyohiro Houkin


About Rapidus Corporation

Rapidus Corporation aims to develop and manufacture the world’s most advanced logic semiconductors. We will create new industries together with our customers through the development and provision of services to shorten cycle times in design, wafer processes, 3D packaging, and more. We will continue to challenge ourselves in order to contribute to the fulfillment, prosperity, and happiness of people’s lives through the use of semiconductors.

Headquarters: 4-1 Kojimachi, Chiyoda-ku, Tokyo 102-0083, Japan
Founded: August 10, 2022
Management: Tetsuro Higashi, Chairman of the Board of Directors
Atsuyoshi Koike, President and Representative Director
Business Areas: Research, development, design, manufacture, and sales of semiconductor devices, integrated circuits and other electronic components
Capital (as of November 2022): 7,346 million yen (includes capital reserves)


Media contacts (Rapidus Corporation):

Kreab K.K.

Kunihiko Yasue, E-mail: kyasue@kreab.com
Takano Okumoto, E-mail: tokumoto@kreab.com
Miki Yagi, E-mail: myagi@kreab.com


Media contact (Hokkaido University):

Atsushi Ueda, Office for Promotion of Semiconductor Hub Formation,
Planning Division, General Affairs and Planning Department
Email: semicon-jimu@general.hokudai.ac.jp