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UPDATE: 2024.06.04

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology

UPDATE: 2024.05.15

Rapidus and Esperanto Technologies
Sign Memorandum of CooperationPromote development and manufacture of more energy-efficient semiconductors for artificial intelligence and other high-performance datacenter applications

UPDATE: 2024.04.12

Rapidus announces U.S. subsidiary and opens Silicon Valley office; names Henri Richard as GM and president of Rapidus Design Solutions

UPDATE: 2024.04.02

NEDO Approves Rapidus’ FY2024 Plan and Budget for “Research and Development of 2nm-generation semiconductor integration technology and short TAT manufacturing technology based on Japan-US collaboration”
Also Selects Rapidus for “Development of Chiplet, Package Design, and Manufacturing Technology for 2nm-Generation Semiconductors”

UPDATE: 2024.02.27

Rapidus to Promote Development and Manufacturing of Edge-AI Accelerator with TenstorrentA collaboration in a project by LSTC, adopted by NEDO

UPDATE: 2023.11.17

Rapidus and Tenstorrent Agree to Joint IP PartnershipAccelerating Development of AI Edge Device Domain Based on 2nm Logic Semiconductors

UPDATE: 2023.09.01

Rapidus Held Groundbreaking Ceremony for IIM-1

UPDATE: 2023.04.25

Rapidus to Begin Construction of Advanced Semiconductor Plant in Chitose City

UPDATE: 2023.04.04

Rapidus joins imec’s Core Partner Program

UPDATE: 2023.02.28

Rapidus Selects Chitose City in Hokkaido for its New State-of-the-Art Semiconductor Plant