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UPDATE: 2024.10.03

Rapidus establishes state-of-the-art back-end semiconductor manufacturing process research-and-development centerRapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson’s Chitose campus

UPDATE: 2024.07.19

Rapidus、EE Times誌の「Silicon 100」に2年連続で選出

UPDATE: 2024.07.19

Rapidus Recognized on EE Times’ “Silicon 100” for Second Consecutive Year

UPDATE: 2024.06.05

Rapidus、北海道大学と包括連携協定を締結～半導体産業を通じた科学技術力の向上、及び人材の育成を目指す～

UPDATE: 2024.06.05

Rapidus Signs Comprehensive Collaboration Agreement with Hokkaido UniversityGoal is to enhance Japan’s scientific and technological capabilities, and develop human resources for the semiconductor industry

UPDATE: 2024.06.04

RapidusとIBM、2nm世代半導体のチップレットパッケージ技術に関するパートナーシップを締結

UPDATE: 2024.06.04

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology

UPDATE: 2024.05.15

Rapidus、エスペラント・テクノロジーズ社と協力覚書(MOC)締結～低消費電力のデータセンター向けAI半導体の開発・製造を推進～

UPDATE: 2024.05.15

Rapidus and Esperanto Technologies
Sign Memorandum of CooperationPromote development and manufacture of more energy-efficient semiconductors for artificial intelligence and other high-performance datacenter applications

UPDATE: 2024.04.12

Rapidus、シリコンバレーに新会社設立～AI半導体関連の顧客開拓・設計支援を加速～