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UPDATE: 2024.10.04

Rapidusの資金調達に関する報道について

UPDATE: 2024.10.04

Statement Regarding Rapidus Funding Rumors

UPDATE: 2024.10.03

Rapidus、最先端半導体（後工程）の研究開発機能をセイコーエプソン千歳事業所内に設置
～パイロットライン工事安全祈願祭を開催～

UPDATE: 2024.10.03

Rapidus establishes state-of-the-art back-end semiconductor manufacturing process research-and-development centerRapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson’s Chitose campus

UPDATE: 2024.07.19

Rapidus、EE Times誌の「Silicon 100」に2年連続で選出

UPDATE: 2024.07.19

Rapidus Recognized on EE Times’ “Silicon 100” for Second Consecutive Year

UPDATE: 2024.06.05

Rapidus、北海道大学と包括連携協定を締結～半導体産業を通じた科学技術力の向上、及び人材の育成を目指す～

UPDATE: 2024.06.05

Rapidus Signs Comprehensive Collaboration Agreement with Hokkaido UniversityGoal is to enhance Japan’s scientific and technological capabilities, and develop human resources for the semiconductor industry

UPDATE: 2024.06.04

RapidusとIBM、2nm世代半導体のチップレットパッケージ技術に関するパートナーシップを締結

UPDATE: 2024.06.04

Rapidus and IBM Expand Collaboration to Chiplet Packaging Technology for 2nm-Generation Semiconductors
Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology